Researchers proposed to reduce the Fresnel Reflection Loss at the chip/encapsulation material interface in the fixed photon escape cone to improve the transmission of the light generated inside the LED chip at the LED chip/encapsulation material interface. The smallest change.
Studies have shown that under peak emission wavelength conditions, the light transmission at the interface of a typical LED chip/encapsulation material can increase up to 99%, while it is only 84% under normal incidence. This solution can improve the light transmission in the photon escape cone in the entire LED emission spectrum, which not only reduces energy consumption, but also improves the life of the LED by reducing the heat generated by unnecessary reflections inside the chip.
Researchers believe that this solution is expected to be easily used and applied to existing semiconductor equipment technology, and can also be used independently or in combination with other methods to reduce the critical angle loss of LEDs.
It is reported that this research has been published in the journal "Light: Science & Application" in July. (Compiled by LEDinside Janice)
