LED pin-type packages use lead frames as the pins of various package appearances. They are the first package structure to be successfully developed and put on the market. There are many varieties and high technology maturity. The internal structure and reflective layer of the package are still being improved. Common is a cylindrical package with a diameter of 5mm. It is suitable for products and fields such as instrument indicator lights, urban lighting projects, advertising screens, barrier tubes, traffic lights, etc.
Surface-mount packaging (SMD) is a new type of LED packaging method, which is a packaging technology that welds an already packaged LED device to a fixed position. The advantages of SMD packaging technology are reliable, easy automation, and good high frequency characteristics. SMD LED packaging is the most popular SMD packaging process in the electronics industry today.
Chip-on-board (COB) LED packaging technology is a direct mounting technology, in which the chip is directly pasted on a printed circuit board, and then the leads are stitched, and finally the chip and leads are packaged and protected by organic glue. It can directly encapsulate multiple chips on the metal-based printed circuit board MCPCB, and directly dissipate heat through the substrate, which not only reduces the manufacturing process and cost of the bracket, but also has the heat dissipation advantage of reducing thermal resistance.
System-in-package (SIP) LED packaging technology is a technology developed in recent years. It mainly meets the requirements of system portability and system miniaturization. Compared with other LED packages, SIP packages have the highest level of integration and relatively low cost. Multiple LED chips can be assembled in one package.
Main products of ZGSM TECH use SMD packaging, and the traffic signal series uses LED pin-type package. Welcome to buy our products.
